The fans on all heatsinks were connected to the same motherboard's 4-pin connector. Sufficient time between testing was ensured for the paste to settle. The thermal paste applied to each cooler was stock respective to their manufacturers to rate its performance. The ambient temperature of the room was roughly 18 degrees Celsius. The computer remained in the same place and room for all tests. Cooler Master MasterLiquid ML280 MirrorĪll tests were run in our custom-built computer to best reflect real-life performance.
#HYPER 212 EVO WINDOWS 10#
Operating System: Microsoft Windows 10 Pro 圆4 Graphics: MSI GeForce RTX 2060 SUPER VENTUS 8GB OC That's how easy it can be to cool.because the thermal load is spread more than enough for good transference.RAM: Corsair Vengeance RGB Pro DDR4-3200 2x8GB It's correct for the task it's assigned.Ĭonsidering a 5900x has 2 dies, and stock and for normal usage it usually consumes about 140w, if you tweak it a bit for efficiency at around 110-120w load spread among all cores, you can cool that thing with a F toy cooler from aliexpress. The fan that comes with the 212 cannot be much improved, because it's not bottlenecking the cooler (same for the one you have). It's not ideal, and requires certain conditions (20✬ ambient, efficient high airflow case, max RPM on cooler, and it was hitting 90✬), but it can do it. is more than what you should load a 212 evo with anyway.
lately it's not even the most important one, because these ryzens are incredibly efficient and well bellow the max load of your avg cooler. The performance difference between one situation and the other is around the 10% mark. you simply cannot draw the heat out of the CPU fast enough. you will see 80-90✬ with a 1000w custom loop. Raise it to 200w+ and you are scorching it no matter how big is the custom loop you're throwing at it. That's how easy it can be to cooled.because the thermal load is spread more than enough for good transference. just to be safe.Ĭonsidering a 5900x has 2 dies, and stock and for normal usage it usually consumes about 140w, if you tweak it a bit for efficiency at around 110-120w load spread among all cores, you can cool that thing with a F toy cooler from aliexpress. Truth is, he's the type who buys and recommends a 1000w PSU just to be safe, or buys a 14 real fase VRM to OC a 5800x.
Implying a 5900x is some beast to be tamed and a 212 would result in burning his CPU or some sh***. The guy above said he wouldn't put a 212 on 5900x even for windows installation. Assuming your case situation doesn't hold you back, and the air going through the case is NOT a lot higher temp than the ambient outside, and you have the amount of static pressure necessary for the cooler which is very low in air coolers in general, you can do whatever you want, you won't improve CPU temps, at least not by an important enough margin.īottom line, you are not held back by the cooler, what's so hard to understand? Saturating a cooler with airflow, doesn't necessarily requires a good fan, or a strong fan. Here is data of NH-D14 and TRUE Spirit 140 Power on i7 920 4.3Ghz.Ĭlick to expand.The fan that comes with the 212 cannot be much improved, because it's not bottlenecking the cooler (same for the one you have). More airflow can and does improve cooling. I"ve ran several extreme airflow systems with 2500rpm fans used for both case and cooler. Air temp into cooler to CPU temp is an almost perfect 1:1 ratio. Every degree warmer air is entering cooler is same degrees hotter cpu end up being. and that means it starts re-using it's cooler's heated exhaust air. Reason is if case does not flow more air then cooler uses, cooler need to find it's air somewhere else. actually case fan increase needs to be increased more than cooler was is.
High airflow can increase cooling, but it also comes with extreme increase in noise.Īnother big problem is most users only increase cooler fan airflow and ignore the fact case fan/s have to provide as least as much an increase in airflow as cooler fan/s. There is also heat transfer through base into heatpipes and heatpipes into fins, but base to heatpipe and heatpipe to fine problems are not usually a problem / bottleneck. Then it's how well heat moves from fins into airflow. Next major transfer issue is how well heatpipe cycles / functions moving heat from base to fin-pack Click to expand.Increasing airflow above about 130cfm doesn't improve cooling much if at all.īiggest things effecting heat transfer are CPU chip to cooler base to heatpipe to fin-pack, into fins and then airflow.įirst major transfer issue is CPU chip to cooler base.
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